|
WHITE RING DEFECT FORMATION IN
LEAD-FREE WAFER LEVEL PACKAGING
FlipChip (FC) and Wafer Level Packaging (WLP) are two of the
fastest growing segments in the integrated circuit (IC)
packaging industry. The practice of incorporating FC or bump
technology in devices is experiencing significant growth, due to
the improvement it provides in power and ground distribution,
with the attendant reduction in simultaneous switching noise, (SSN).
The demand for WLPs is increasing due to their small form factor
and the increased demand for portable products.
Read More...
ANALYSIS OF POLYIMIDE PASSIVATION
DAMAGE IN WAFER-LEVEL REMOVAL AND CLEANING PROCESSES
Polyimides are a class of organic
polymers that have been used widely by the semiconductor and
electronics industries. In wafer level packaging, their
characteristics make them suitable for use as stress buffers and
passivation layers. Downstream processing of wafers with
polyimide films presents important challenges because damaged
films correlate directly with decreases in device performance
and wafer yield, thereby increasing the cost of ownership.
This paper will describe work done at DynaloyTM on the
causes and effects of photoresist cleaning formulations on
underlying passivations, particularly polyimide.
Read More...
|
